ADSORBSI LOGAM Cu DARI LIMBAH ELEKTROPLATING MENGGUNAKAN KARBON AKTIF DALAM KOLOM FIXED BED

Kwartiningsih, Endang and Setiarini, Nanda (2005) ADSORBSI LOGAM Cu DARI LIMBAH ELEKTROPLATING MENGGUNAKAN KARBON AKTIF DALAM KOLOM FIXED BED. EKUILIBRIUM, 4 (2). pp. 78-84.

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    Abstract

    Waste of industries generates contamination to environment, especially river stream. One of them was the waste of electroplating industries. Generally, it still contained copper metal above the concentration’s limit. The government has settled it which was 0.1 mgram of copper/liter of solution. The effects of accumulation copper in human body were gastrointestinal irritation, liver and kidney damage. So, it was needed an effort to reduce copper concentration before thrown to environment. One of the treatment was an adsorbtion method. This research aim’s was to know the value of mass transfer coefficient of copper adsorbtion. This research was conducted in fixed bed column with active carbon as adsorbent. The variable observed was rate of flow. Every period of time, the liquid flowed from the column was analyzed using AAS, so it was known copper concentration after adsorption process. In this research, mathematical model representing the adsorption process was made. The correlation between rate of flow and k ca was represented with Non Dimensional Group equation, which is : 1547,0 2 5676.0       ⋅ ⋅ = ⋅ µ ρ Dp F Dv DpKca Keywords : electroplating, adsorption, AAS, mass transfer coefficient, copper

    Item Type: Article
    Subjects: T Technology > TP Chemical technology
    Divisions: UNSPECIFIED
    Depositing User: mr azis r
    Date Deposited: 13 May 2013 18:47
    Last Modified: 13 May 2013 18:47
    URI: https://eprints.uns.ac.id/id/eprint/660

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